NewLogic to Demonstrate BOOST IP at Bluetooth Congress 2000

NewLogic will demonstrate "live" Bluetooth systems featuring their BOOST(tm) baseband core and software protocol stack at their booth (52) during the Bluetooth(tm) Congress 2000 event at the Centre de Congres in Monte Carlo from June 14th to June 16th.

The BOOST(tm) (standing for Bluetooth Original On-chip SysTem) IP package consists of an embeddable Bluetooth baseband processor core, a full Bluetooth software protocol stack and a Bluetooth CMOS transceiver. For the purposes of the demonstration, the baseband core will be embedded into an FPGA, which in turn is incorporated on an ARM(tm) emulation board. Using radio modules from third-party vendors, a Bluetooth communication link will be established between two BOOST(tm) enabled systems.

"The sky is the limit when it comes to the range of applications which will be Bluetooth-enabled," said Mr. Hans-Peter Metzler, President and CEO of NewLogic. "The ingenuity of Bluetooth system designers will require that Bluetooth functionality be made available not only as standard ICs, but also in the form of IP products. Baseband and radio cores, which can be incorporated into custom ASIC and ASSP products, will fuel a wide spectrum of novel Bluetooth applications."

NewLogic's BOOST(tm) baseband processor core is supplemented by a user-friendly SDL-based software protocol stack. The baseband core and protocol stack contain a number of user-selectable options which permit their use with most micro-controllers and Bluetooth radio modules. Although the core and stack were developed together to provide a seamless solution, they can be used equally well in conjunction with compatible products from other vendors. The software can be easily adapted for use in all Bluetooth applications, ranging from low-end, cost-driven products, to high-end systems with rich feature sets.

Bluetooth wireless technology is the new cordless standard adopted by more than 1800 companies throughout the world to link portable devices to mobile phones and PCs. It has spurred an unprecedented enthusiasm within the PC and communications industries. Its promises of small-size, low-cost and interoperability have fuelled a burst of new ideas and applications possibilities.


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