Taiyo Yuden Co. Ltd. today announced availability of evaluation kits for its three Bluetooth(TM) Modules, allowing engineers to prepare development environments for evaluating use of these modules in their designs.
The kits include each module mounted on an evaluation board, a technical manual, a Host Control Interface (HCI) command tool (available only with the full module) that allows direct control of the module's HCI software from an external PC, and a UART interface for RS-232 communications.
Taiyo Yuden's Bluetooth Modules are based on the SiW chipset developed by Silicon Wave Inc., a San Diego-based high-frequency semiconductor development company. The single-chip radio modem utilizes Silicon-on-Insulator (SOI) BiCMOS process technology and direct conversion demodulation, resulting in high-isolation, low switching loss, use of fewer subcomponents (such as SAW filters or LC filters), and thus lower cost and smaller size.
Bluetooth is the next-generation wireless communication specification at the 2.4 GHz band for a small-form factor, low-cost radio solution providing cable-free connections between mobile phones, portable computers and other handheld electronic devices, as well as Internet connectivity. Combining its expertise in multilayered component manufacturing, high-frequency circuitry design, advanced assembly techniques and evaluation technologies with aggressive Bluetooth research and development and strategic partnerships, Taiyo Yuden is rapidly emerging as a leader in Bluetooth module development and implementation.
Among the primary features of the Bluetooth RM Module are a fully digital interface, built-in crystal oscillators, and modem function in the RF chip. Taiyo Yuden's feature-rich RM modules allow expanded design freedom and are currently supported by more than 10 baseband controller manufacturers. For additional information regarding samples and evaluation kits, please see Taiyo Yuden's Web site: www.yuden.co.jp/bluetooth
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