Taiyo Yuden Partners with Transilica for Product Development in Short Distance Wireless Communications

New Single-Chip Module Design Solution Offered to the Bluetooth Market

Taiyo Yuden, a forerunner in the field of Bluetooth module development and manufacturing, announced today that an agreement has been signed with Transilica Inc. (Hock Law, CEO), a leading company in the design of miniature, high reliability, high performance RF system-on-chip semiconductor products.

Bluetooth modules are expected to grow significantly as the short distance wireless communications market develops for portable electronics. With this agreement, Transilica will supply Bluetooth OneChip products containing integrated flash memory and a variety of embedded software options. Taiyo Yuden will start sampling the new modules from November 2001, with volume quantities starting in February 2002. Taiyo Yuden expects that the new partnership will improve the ability to address various customer needs in the personal computer, PDA and mobile phone sectors.

Taiyo Yuden is the first company to receive Bluetooth qualification for its full modules. Since the qualification in April 2001, Taiyo Yuden has been mass-producing modules for personal computer and peripheral devices. With this agreement with Transilica, Taiyo Yuden will be expanding product offerings to address the needs of the growing mobile market that includes cell phones, notebooks and PDAs.

Transilica's OneChip(TM) System-on-Chip (SoC) features a fully integrated solution that incorporates the RF receiver, baseband modem, and a flash memory containing the basic application set, into a single chip. Cost performance is greatly improved by integrating most of the Bluetooth components into a single package. A proprietary data compression technology allows the installation of application sets to be offered as a standard feature. By leveraging the multilayer, high frequency design and high-density mounting expertise at Taiyo Yuden, products will be offered as a full module and will be expected to become the de facto standard in the mobile communications industry.

Taiyo Yuden will be displaying products at the CEATEC Japan 2001 exhibition (Oct. 2-6, 2001) at booth 1A02.


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